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Applied Physics Letters : Thermal sintering of solution-deposited nanoparticle silver ink films characterized by spectroscopic ellipsometry

By Heng Pan, Seung H. Ko, and Costas P. Grigoropoulos

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Book Id: WPLBN0002169267
Format Type: PDF eBook :
File Size: Serial Publication
Reproduction Date: 10 December 2008

Title: Applied Physics Letters : Thermal sintering of solution-deposited nanoparticle silver ink films characterized by spectroscopic ellipsometry  
Author: Heng Pan, Seung H. Ko, and Costas P. Grigoropoulos
Volume: Issue : December 2008
Language: English
Subject: Science, Physics, Natural Science
Collections: Periodicals: Journal and Magazine Collection (Contemporary), Applied Physics Letters Collection
Historic
Publication Date:
Publisher: American Institute of Physics

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Seung H. Ko, And Costas P. Grigoropoulo, H. P. (n.d.). Applied Physics Letters : Thermal sintering of solution-deposited nanoparticle silver ink films characterized by spectroscopic ellipsometry. Retrieved from http://hawaiilibrary.net/


Description
Description: Low-temperature sintering of metal nanoparticle inks is a promising technique in realizing large area and flexible electronics. It is demonstrated in this letter that spectroscopic ellipsometry in the spectral region of 0.75–3.5 eV can be employed to characterize the sintering process manifested by the evolution of film thickness, effective dielectric function, and percolation transition. A two-oscillator model can be used to model the effective dielectric function. The oscillator energy shifts lower and correlates well with the increase in dc conductance as demonstrated by both in situ and ex situ ellipsometric measurements. A simple model based on two-dimensional R-L-C impedance network was adopted to explain experimental results quantitatively.

 

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